Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
- /
- Pages.573-574
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- 2006
The Surry Characteristic Using Monitoring System in MEMS CMP
MEMS CMP에서 모니터링 시스템을 이용한 슬러리 특성
- Park, Sung-Min (Department of precision & Mechanical Engineering in PNU) ;
- Jeong, Suk-Hoon (Department of precision & Mechanical Engineering in PNU) ;
-
Park, Boum-Young
(Department of precision & Mechanical Engineering in PNU)
;
-
Lee, Sang-Gik
(Department of precision & Mechanical Engineering in PNU)
;
- Jeong, Won-Duk (Department of precision & Mechanical Engineering in PNU) ;
- Jang, One-Moon (Department of precision & Mechanical Engineering in PNU) ;
-
Jeong, Hae-Do
(School of Mechanical Engineering in PNU)
- 박성민 (부산대학교 정밀기계공학과) ;
- 정석훈 (부산대학교 정밀기계공학과) ;
-
박범영
(부산대학교 정밀기계공학과)
;
-
이상직
(부산대학교 정밀기계공학과)
;
- 정원덕 (부산대학교 정밀기계공학과) ;
- 장원문 (부산대학교 정밀기계공학과) ;
-
정해도
(부산대학교 기계공학부)
- Published : 2006.06.22
Abstract
The planarization technology of Chemical-mechanical polishing(CMP), used for the manufacturing of multi-layer various material interconnects for Large-scale Integrated Circuits (LSI), is also readily adaptable as an enabling technology in MicroElectroMechanical System (MEMS) fabrication, particularly polysilicon surface micromachining. However, general LSI device CMP has partly distinction aspects, the pattern scale and material sorts in comparison with MEMS CMP. This study performed preliminary CMP tests to identify slurry characteristic used in general IC device. The experiment result is possible to verify slurry characteristic in MEMS structure material.