한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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- Pages.233-234
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- 2006
무수축 LTCC 공정 중 Via Paste의 조성에 따른 Via 주변의 기공감소에 관한 연구
Study on Reduction of Via hole Pore by Composition variation of Via paste during LTCC Constrained Sintering Process
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Cho, Hyun-Min
(Korea Electronics Technology Institute)
;
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Kim, Jong-Gyu
(Korea Electronics Technology Institute)
- 발행 : 2006.11.09
초록
In this paper, Via hole pore were investigated during PLAS (PessureLess Assisted Constrained Sintering) process of LTCC. Ag and Ag-Pd paste mixture were tested for via paste. Ag paste with 10~25% Ag-Pd paste showed no via hole pore, but further increase of Ag-Pd contents in via paste increased via pore. From shrinkage curve, 10~25% Ag-Pd paste showed expansion behaviors before shrink and this phenomena result in the reduction of via hole pore during PLAS process.