Silicon Containing Bottom Anti-Reflective Coating for ArF Photolithography

ArF 포토리소그라피공정을 위한 실리콘이 함유된 반사방지막코팅

  • 이준호 (금호석유화학 전자재료연구소) ;
  • 김형기 (금호석유화학 전자재료연구소) ;
  • 김명웅 (금호석유화학 전자재료연구소) ;
  • 임영택 (금호석유화학 전자재료연구소) ;
  • 박주현 (금호석유화학 전자재료연구소)
  • Published : 2010.04.01

Abstract

Development of ArF Photo-lithography process has proceeded with the increase of numerical aperature (NA) and the decrease of resist thickness. It makes many problems such as cost and process complexity. A novel spin-on hard mask system is proposed to overcome many problems Spin-on hard mask composed of two layers of siloxane and carbon. The optical thickness of two layers is designed from reflectivity measurement at specified n, k respectively. The property of photo-resist shows different results according to Si contents. Si-contents was measured XPS(X-ray Photoelectron spectroscopy).

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