한국정보디스플레이학회:학술대회논문집
- 2006.08a
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- Pages.341-344
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- 2006
Study on Scribing Sapphire Wafer for LED
- Moon, Yang-Ho (Samsung Electromechanics) ;
- Kim, Nam-Seung (Samsung Electromechanics)
- Published : 2006.08.22
Abstract
LED chips are produced by cutting the sapphire on which GaN is evaporated. To cut the sapphire wafer into each LED chip, at first the wafer is scribed by diamond tool. To get the sharp groove shape for the nice cutting plane it is important the diamond tool shape, load, etc when the wafer is scribed. Here we tried to simulate the scribing process and get the scribing condition to reduce the wear rate of diamond tool for the sharp groove shape.
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