Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2006.10a
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- Pages.81-82
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- 2006
Effects of Mixed Abrasive Slurry(MAS) on Metal CMP Characteristics
MAS (Mixed Abrasive Slurry)가 Metal CMP에 미치는 영향
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Lee, Young-Kyun
(Daebul University)
;
- Park, Sung-Woo (Daebul University) ;
- Lee, Woo-Sun (Chosun University) ;
- Seo, Yong-Jin (Daebul University)
- Published : 2006.10.27
Abstract
Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, so as to investigate the influence of mixed abrasive slurry (MAS), such as
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