Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지

Toward the 3D-SiP Era with New Technologies

  • Kada, Morihiro (Assembly and Packaging Development Dept. Sharp Corporation)
  • Published : 2006.10.11
Download PDF
⟨ Previous Next ⟩

Abstract

Keywords