Reliability Assessment Methods for Electronic Component Removed Environmental Materials - focused on Printed Wiring Board without Pb and Br -

환경물질을 제외한 전자부품의 신뢰성평가 방법 연구 - Pb와 Br을 제거한 PWB를 중심으로 -

  • Lee, Jong-Beom (Reliability Engineering Management Center, KSA) ;
  • Cho, Jai-Rip (Department of Industrial Engineering of Kyung Hee University)
  • 이종범 (한국표준협회 신뢰성기술경영센터) ;
  • 조재립 (경희대학교 공과대학 산업공학과)
  • Published : 2006.04.08

Abstract

When the environmental materials of the raw and sub material to applied in electronic goods removed, the reliability assessment and the forecasting is stand on the low level and in case of neglect, it is acting as latent defect that can be connected to large size disaster. In this research, the study on the management method of environmental restriction substances which is recognized as important element in the reliability assessment about environmental material of electronic goods and the study on reliability assessment method of PWB without environmental material are progressed

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