Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2005.06a
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- Pages.43-45
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- 2005
Analysis of Transmission Infrared Laser Bonding for Micro Polymer Devices
폴리머 마이크로 칩에 대한 레이저 투과 마이크로 접합
Abstract
A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted to heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated and heat transfer model was applied for obtaining the transient temperature profile. The transmission laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip.
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