Study on Characteristics of Chemical Mechanical Polishing of BTO Thin Film

BTO 박막의 화학적 기계적 연마 특성 연구

  • Published : 2005.07.07

Abstract

Sufficient removal rate with adequate selectivity to realize the pattern mask of tetra-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained by chemical mechanical polishing (CMP) with commercial silica slurry as a function of pH variation. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible.

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