UV Nanoimprint Lithography using an Elementwise Patterned Stamp and Pressurized Air

Elementwise Patterned Stamp와 부가압력을 이용한 UV 나노임프린트 리소그래피

  • Sohn H. (Intelligent Precision Machine Division, KIMM) ;
  • Jeong J.H. (Intelligent Precision Machine Division, KIMM) ;
  • Sim Y.S. (Intelligent Precision Machine Division, KIMM) ;
  • Kim K.D. (Intelligent Precision Machine Division, KIMM) ;
  • Lee E.S. (Intelligent Precision Machine Division, KIMM)
  • 손현기 (한국기계연구원 지능형정밀기계연구본부) ;
  • 정준호 (한국기계연구원 지능형정밀기계연구본부) ;
  • 심영석 (한국기계연구원 지능형정밀기계연구본부) ;
  • 김기돈 (한국기계연구원 지능형정밀기계연구본부) ;
  • 이응숙 (한국기계연구원 지능형정밀기계연구본부)
  • Published : 2005.06.01

Abstract

To imprint 70-nm wide line-patterns, we used a newly developed ultraviolet nanoimprint lithography (UV-NIL) process in which an elementwise patterned stamp (EPS), a large-area stamp, and pressurized air are used to imprint a wafer in a single step. For a single-step UV-NIL of a 4' wafer, we fabricated two identical $5'\times5'\times0.09'(W{\times}L{\times}H)$ quartz EPSs, except that one is with nanopatterns and the other without nanopatterns. Both of them consist of 16 small-area stamps, called elements, each of which is $10\;mm\;\times\;10\;mm$. UV-curable low-viscosity resin droplets were dispensed directly on each element of the EPSs. The volume and viscosity of each droplet are 3.7 nl and 7 cps. Droplets were dispensed in such a way that no air entrapment between elements and wafer occurs. When the droplets were fully pressed between ESP and wafer, some incompletely filled elements were observed because of the topology mismatch between EPS and wafer. To complete those incomplete fillings, pressurized air of 2 bar was applied to the bottom of the wafer for 2 min. Experimental results have shown that nanopatterns of the EPS were successfully transferred to the resin layer on the wafer.

Keywords