반도체 리드프레임 펀치의 좌굴에 관한 보강설계

The Reinforced Design for the Buckling of Semiconductor Lead Frame Punch

It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.