Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.11a
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- Pages.362-363
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- 2005
A study of planarization in polysilicon MEMS structure
폴리실리콘 MEMS 구조물의 평탄화에 관한 연구
- Jeong, Moon-Ki (School of Mechanical Engineering, PNU) ;
- Park, Sung-Min (School of Mechanical Engineering, PNU) ;
- Jung, Jae-Woo (School of Mechanical Engineering, PNU) ;
- Jeong, Hae-Do (School of Mechanical Engineering, PNU) ;
- Kim, Hyoung-Jae (G&P technology)
- Published : 2005.11.10
Abstract
The objectives of this paper are to achieve good planarization of the deposited film and to improve deposition efficiency of multi-layer structures by using surface-micromaching process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages and disadvantages of CMP for MEMS structures are observed respectively by using the test patterns with structures larger than 1 um line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of slurries: ILD1300 and Nalco2371. And then, the experiments were conducted based on the pretest.