Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Optimization of Chip Stack in 3D Packaging

  • Hara Kazumi (Advanced Technology Development Department Seiko Epson corporation)
  • Published : 2005.09.01
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