Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2004.11a
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- Pages.1522-1527
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- 2004
Optimization of Groove Sizing in CMP using CFD
CFD를 이용한 CMP의 Groove Sizing 최적화
- Published : 2004.11.03
Abstract
In this paper, slurry fluid motion, abrasive particle motion, and effects of groove sizing on the pads are numerically investigated in the 2D geometry. Groove depth is optimized in order to maximized the abrasive effect. The simulation results are analyzed in terms of shear stress on pad, groove and wafer, streamline and velocity vector. The change of groove depth entails vortex pattern change, and consequently affects material removal rate. Numerical analysis is very helpful for disclosing polishing mechanism and local physics.