Layer-by-layer nitrogenation of microcrystalline silicon for TFT applications

  • Bu, I. (Engineering Department, Cambridge University) ;
  • Milne, W.I. (Engineering Department, Cambridge University)
  • Published : 2004.08.23

Abstract

We have optimized the low temperature growth of microcrystalline silicon at 80$^{\circ}C$. This material has been used to fabricate bottom gate ${\mu}c$-Si:H TFTs by using a layer-by-layer nitrogenation process. By using this process the amorphous incubation layer can be converted into silicon nitride and leads to an increase in field effect mobility of the TFT

Keywords