한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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- Pages.231-234
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- 2004
CMP 공정에서 마찰력 측정을 통한 마멸 및 윤활 특성에 관한 연구
Characteristic of the Wear and Lubrication using the Friction Froce Measurement in CMP Process
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박범영
(부산대학교 정밀기계공학과) ;
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김형재
(부산대학교 정밀기계공학과) ;
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서헌덕
(부산대학교 정밀기계공학과) ;
- 김구연 (부산대학교 정밀기계공학과) ;
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이현섭
(부산대학교 정밀기계공학과) ;
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정해도
(부산대학교 정밀정형 및 금형가공 연구소)
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Park, Boum-Young
(Precision and Mechanical Eng., Pusan National Uni.) ;
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Kim, Hyoung-Jae
(Precision and Mechanical Eng., Pusan National Uni.) ;
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Seo, Heon-Deok
(Precision and Mechanical Eng., Pusan National Uni.) ;
- Kim, Goo-Youn (Precision and Mechanical Eng., Pusan National Uni.) ;
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Lee, Hyun-Seop
(Precision and Mechanical Eng., Pusan National Uni.) ;
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Jeong, Hae-Do
(ERC, Pusan National Uni.)
- 발행 : 2004.07.05
초록
Chemical mechanical polishing(CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with the slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various coefficient of friction was attained and analyzed with the kind of pad, abrasive and the abrasive concentration. The lubrication regime is also classified with
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