Analysis of Package Drop and its Application for Optical Disc Drives

광 디스크 드라이브용 완충포장재의 낙하충격 해석 및 활용

Electronic products are subjected to many different types of shock environment. As the Optical Disc Drive (ODD) market grows, the number of failures related to shock increases. Therefore, it is necessary to improve the performance of cushion package as well as the product design. Cushion materials such as expanded polystyrene are often used to protect electronic products from shock environment. In this paper, the drop analysis of the cushion package f3r optical disc drives was carried out with the explicit method of LS-DYNA and verified by the drop test. For the optimization of package, response surface approximation model was created using central composite design. As a result, cushioning performance was improved under the critical condition and practical design guidelines of cushion package were suggested.