한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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- Pages.382-385
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- 2003
구리 CMP 슬러리를 위한 산화제 $H_2O_2$ 의 안정성
Stability of Oxidizer $H_2O_2$ for Copper CMP Slurry
- Lee, Do-Won (Chung-Ang University) ;
- Kim, In-Pyo (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, Sang-Yong (Dongbu-Anam Semiconductor) ;
- Seo, Yong-Jin (Daebul University) ;
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Chang, Eui-Goo
(Chung-Ang University)
- 발행 : 2003.07.10
초록
Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide(