한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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- Pages.256-258
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- 2003
Indium-silver alloy를 이용한 접합의 특성
The characteristics of joints with In-Ag alloy
- Kim, Jae-Wook (Korea Univ.) ;
- Kim, Je-Yoon (Korea Univ.) ;
- Kim, Sang-Sig (Korea Univ.) ;
- Sung, Man-Young (Korea Univ.)
- 발행 : 2003.07.10
초록
Two Si wafers are bonded with indium-silver alloy using diffusion bonding method. When silver and indium thin films are contacted, they diffuse into each other and form inter-metallic compounds like