나노 세리아 슬러리에 첨가된 연마입자와 첨가제의 농도가 CMP 연마판 온도에 미치는 영향

  • 김성준 (한양대학교 나노 SOI 공정 연구실) ;
  • 강현구 (한양대학교 나노 SOI 공정 연구실) ;
  • 김민석 (한양대학교 나노 SOI 공정 연구실) ;
  • 박재근 (한양대학교 나노 SOI 공정 연구실)
  • 발행 : 2003.12.01

초록

We investigated the effect of the abrasive and additive concentrations in Nano ceria slurry on the pad surface temperature under varying pressure through chemical mechanical polishing (CMP) test using blanket wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with increase of the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surface during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increase of the additive concentration. This difference of temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, which means the higher friction coefficient.

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