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Microfabrication by Localized Electrochemical Deposition Using Ultra Short Pulses

In this research, microfabrication technique using localized electrochemical deposition is presented. Electric field is localized near the tip end region by applying ultra short pulses. Platinum tip is used as the counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The deposition characteristics such as size, shape, and structural density according to pulse duration and applied voltage are investigated. Micro-columns less than 10 $\mu\textrm{m}$ in diameter are fabricated using the presented technique. The process can be potentially used for three dimensional metal structure fabrications with micrometer feature size.