Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.09a
- /
- Pages.253-257
- /
- 2003
Low Temperature Flip Chip Bonding Process
- Kim, Young-Ho (Div. of Materials Science & Engineering, Hanyang University)
- Published : 2003.09.01
Abstract
The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp:
Keywords