Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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The Solder Joint Reliability Result with Ultra Thin Pd-PPF

초박막 Pd-PPF에 의한 Solder Joint Reliability 평가결과

  • 강성일 (삼성테크윈 반도체 부품생산 패키지재료개발) ;
  • 박세철 (삼성테크윈 반도체 부품생산 패키지재료개발)
  • Published : 2003.11.01
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