Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effect of plasma treatment on adhesion of EMC and Ag plated leadframe

EMC 와 Ag 도금된 leadframe 표면의 접착효과에 관한 Plasma 처리의 영향

  • Shin June Ho (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
  • Yoo Min (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
  • Yoo Hee Yeoul (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.)
  • Published : 2003.11.01
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