한국반도체및디스플레이장비학회:학술대회논문집 (Proceedings of the Korean Society Of Semiconductor Equipment Technology)
- 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
- /
- Pages.27-33
- /
- 2002
Estimation of Thermal Stresses Induced in Polymeric Thin Film Using Boundary Element Methods
- Lee, Sang-Soon (School of Mechatronics Engineering Korea University of Technology and Education)
- 발행 : 2002.11.01
초록
The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.
키워드