Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Next Generation Electronic Packaging and Bumpless Interconnection

  • Tadaotomo Suga (The University of Tokyo, Research Center for Science and Technology) ;
  • Toshihiro Itoh (The University of Tokyo, Research Center for Science and Technology) ;
  • Akitsu Shigetou (The University of Tokyo, Research Center for Science and Technology)
  • Published : 2002.09.01
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