Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2001.05b
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- Pages.34-37
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- 2001
A Study on Improvement of Slurry Filter Efficiency in the CMP Process
CMP 공정에서 슬러리 필터의 효율 개선에 관한 연구
Abstract
As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the inter-metal dielectrics (IMD) layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5
Keywords
- Chemical mechanical polishing (CMP);
- inter-metal dielectric (IMD);
- point of use (POU);
- micro-scratch;
- pad lifetime;
- high spray