Heat Transfer Analysis of a Linear Motor for Chip Mounter Applications

칩 마운터용 리니어 모터의 열전달 해석

Heat transfer analysis of a iron core type linear motor for surface mounting device applications was considered in this study. In order to avoid the complex conjugate problem a fluid flow regime and a solid regime were considered separately. First, film coefficients of the moving parts were evaluated from computational fluid dynamic analysis and those of the stationary parts from the existing empirical or analytic correlations. And then, by applying them, internal and external temperatures of the linear motor pal1s were computed through finite element analysis. Both computation and measurement were carried out with respect to motor driving power. The measurement did not exhibit a linear temperature variation trend with respect to motor power while the computation revealed a linear correlation. Nonetheless, the computations agreed with the measurements within an error range of 20%. It indicates that an adequate heat transfer model for the reciprocative coil assembly may help more exact prediction.