Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2001.05a
- /
- Pages.273-276
- /
- 2001
Thermal Fatigue Life Prediction of $\mu$ BGA Solder Joint Using Lead-free Solder Materials
무연솔더를 이용한 $\mu$ BGA 솔더접합부의 열피로수명 예측
Abstract
Keywords