Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.09a
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- Pages.193-205
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- 2001
Solder Bumping Technology using Ti-W/ Cu Structure
- Hwang, Kyu-Sung (MICROSCALE CO., LTD) ;
- Choi, Sung-Chang (MICROSCALE CO., LTD) ;
- Bok, Kyung-Soon (MICROSCALE CO., LTD) ;
- Chi, In-Ho (MICROSCALE CO., LTD) ;
- Jin, Jeong-Gi (MICROSCALE CO., LTD)
- Published : 2001.09.01
Abstract
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