A Study on the Plasma Enhanced Hot-wire CVD Grown Miorocrystalline Silicon Films for Photovoltaic Device Applications

태양전지 응용을 위한 플라즈마 열선 화학기상증착법으로 성장한 미세결정 실리콘에 관한 연구

  • 유진수 (성균관대학교 전기전자 및 컴퓨터 공학부) ;
  • 임동건 (성균관대학교 전기전자 및 컴퓨터 공학부) ;
  • 고재경 (성균관대학교 전기전자 및 컴퓨터 공학부) ;
  • 박중현 (성균관대학교 전기전자 및 컴퓨터 공학부) ;
  • 이준신 (성균관대학교 전기전자 및 컴퓨터 공학부)
  • Published : 2001.07.01

Abstract

Microcrystalline Si films have been deposited by using five W-wire filaments of 0.5 mm diameter for hot-wire chemical vapor deposition (HWCVD). We compared the HWCVD grown films with the film exposed to transformer couple plasma system for the modification of seed layer. W-wire filament temperature was maintained below 1600$^{\circ}C$ to avoid metal contamination by thermal evaporation at the filament. Deposition conditions were varied with H$_2$dilution ratio, with and without plasma treatment. From the Raman spectra analysis, we observed that the film crystallization was strongly influenced by the H$_2$dilution ratio and weakly depended on the distance between the wire and a substrate. We were able to achieve the crystalline volume fraction of about 70% with an SiH$_4$/H$_2$ratio of 1.3%, a wire temperature of 1514$^{\circ}C$, a substrate separation distance of 4cm, and a chamber pressure of 38 mTorr. We investigated the influence of ${\mu}$c-Si film properties by using a plasma treatment. This article also deals with the influence of the H$_2$dilution ratio in crystallization modification.

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