A Study to Improve Temperature Uniformity in Hot Plate Oven for Silicon Wafer Manufacturing

반도체 웨이퍼용 핫 플레이트 오븐에서 온도 균일도 향상을 위한 연구

Temperature variation during silicon wafer baking is mainly due to natural convection caused by temperature difference between silicon wafer and upper plate. Several cases are tested and calculated numerically to improve temperature uniformity. The temperature difference and velocity magnitude in the flow cell is reduced for a small gap between the wafer and upper plate because the natural convection force is suppressed in the small space. The uniform temperature distribution can be obtained with controling the incoming flow distribution from the upper plate. An alternative method is the adiabatic wall condition on the upper plate to maintain the temperature uniformity within $0.3^{\circ}C$ on the water plate.