한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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- Pages.7-38
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- 2000
Adhesive Flip Chip Technology
- Paik, Kyung-W (KAIST Dept. of Materials Science and Engineering MicroElectronic Packaging Lab.(MEPL))
- 발행 : 2000.10.01
초록
Performance, reliability, form factor drive flip chip use. BGAs and CSPs will provide stepping stone to FC DCA .Growing vendor infrastructure - Low cost, high density organic substrates -New generations of fluxes and underfills .Adhesives flip chip technology as a low cost flip chip alternatives -Low cost Au stud or Electroless Ni bumps -Reliable thermal cycling and electrical performance.
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