Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.10a
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- Pages.7-38
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- 2000
Adhesive Flip Chip Technology
- Paik, Kyung-W (KAIST Dept. of Materials Science and Engineering MicroElectronic Packaging Lab.(MEPL))
- Published : 2000.10.01
Abstract
Performance, reliability, form factor drive flip chip use. BGAs and CSPs will provide stepping stone to FC DCA .Growing vendor infrastructure - Low cost, high density organic substrates -New generations of fluxes and underfills .Adhesives flip chip technology as a low cost flip chip alternatives -Low cost Au stud or Electroless Ni bumps -Reliable thermal cycling and electrical performance.
Keywords