Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2000.07a
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- Pages.99-102
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- 2000
Study on Via hole formation in multi layer MCM-D substrate using photosensitive BCB
감광성 BCB를 사용한 다층 MCM-D 기판에서 비아홀 형성에 관한 연구
Abstract
Via for achieving reliable fabrication of MCM-D substrate was formed on the photosensitive BCB layer. MCM-D substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in photosensitive BCB layer, the process of BCB and plasme etch using