Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1999.11d
- /
- Pages.944-946
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- 1999
Effects of Post-curing on Thermal Stability of Epoxy-sioxane IPN Structure
Epoxy-siloxane IPN의 열적 안정성에 미치는 후기경화의 영향
- Cho, Young-Shin (Dept. of Chem. Eng., The Univ. of Seoul) ;
-
Shim, Mi-Ja
(Dept. of Life Sci. The Univ. of Seoul)
;
- Kim, Sang-Wook (Dept. of Chem. Eng., The Univ. of Seoul)
- Published : 1999.11.20
Abstract
The thermal stability of the post cured epoxy-polysiloxane IPN structure was observed by using DSC and TGA. As the post curing time increased the glass transition temperature increased and the secondary exothermic peak disappeared. The thermally decomposing activation energy calculated by using Kissinger expression was 225.6 kJ/mol. The thermal stability of the grafted IPN of epoxy and silicon compound depends on the composing ratio and post curing conditions of time and temperature.
Keywords