Quasi-3D Capacitance Extraction Methodology for the Multi-layer Interconnects

다층 배선에서의 Quasi-3D 커패시턴스 추출

A new accurate as well as efficient multi-layer interconnect capacitance extraction method is presented. Since Multi-layer interconnects is too complicated to directly extract capacitances, it is simplified with virtual ground concept. To make the structure tractable, the shielding effects should be separately determined. Since the electric field shielding effects, and the solid-ground-based capacitance matrices can be readily determined from the layout geometry, the accurate as well as efficient quasi-3D capacitances concerned with an objective line can be readily determined. In order to demonstrate its efficiency and accuracy, the parameters and circuit responses were benchmarked with 3D-field-solver-based results.