Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 1999.06a
- /
- Pages.385-388
- /
- 1999
Frequency-Variant Power and Ground Plane Model for Electronic Package
패키지의 주파수 의존형 파워 및 그라운드 평판 모델
Abstract
A new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters 〔2〕 and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package.
Keywords