Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 1999.11a
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- Pages.99-102
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- 1999
The Study on Properties of LCP(Liquid Crystalline Polymer) Compounds for Microelectronic Packaging Materials
열가소성 액정고분자수지를 이용한 반도체 봉지재의 물성연구
Abstract
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