Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 1999.11a
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- Pages.85-88
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- 1999
High thermally conductive EMC(Epoxy Molding Compounds) using high filter loading technique
고충진 기술을 이용한 고방열성 EMC
Abstract
Keywords