Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 1999.11a
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- Pages.13-21
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- 1999
Development of a new wafer level package by using a redistribution technique
- Lee, Young-Min (Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute) ;
- Lee, Sang-Pok (Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute) ;
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Ju, Chul-Won
(Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute)
;
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Park, Seong-Su
(Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute)
- Published : 1999.11.01
Abstract
Keywords