Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1999.05a
- /
- Pages.104-104
- /
- 1999
Improvement of CVD-TiN diffusion barrier performance in Cu metallization by a thin Al interlayer between Cu and TiN
Cu 배선 공정에서 Al 중간층을 이용한 CVD-TiN 확산 방지막의 성능 향상
Abstract
Keywords