Device Characteristics of GaN MESFET with the maximum frequency of 10 GHz

최대추파 10 GHz GaN MESFET의 소자특성

  • 이원상 (LG 종합기술원 소자재연구원 RF device 그룹) ;
  • 정기웅 (LG 종합기술원 소자재연구원 RF device 그룹) ;
  • 문동찬 (광운대학교 전자재료학과) ;
  • 신무환 (명지대학교 세라믹공학과 반도체재료/소자연구실)
  • Published : 1999.05.01

Abstract

This paper reports on the fabrication and characteristics of recessed gate GaN MESFETs fabricated using a photoelectrochemical wet etching method. The unique etching process utilizes photo-resistive mask and KOH based etchant. GaN MESFETs with successfully recessed gate structure was characterized in terms of dc and RF performance. The fabricated GaN MESFET exhibits a current saturation at $V_{DS}$ = 4 V and a pinch-off at $V_{GS}$ =-3V The peak drain current of the device is about 230mA/mm at 300 K and the value is remained almost same for 500K operation. The $f_{T}$ and $f_{max}$ from the device are 6.357Hz and 10.25 GHz, respectively.y.y.

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