Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1999.11a
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- Pages.475-478
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- 1999
Thermal Properties of Interpenetrating Polymer Network Epoxy-silicone Compound
- Cho, Young-Shin (Dept.of Chemical Engineering, University of Seoul) ;
-
Shim, Mi-Ja
(Seoul city University)
;
- Klm, Sang-Wook (Dept.of Chemical Engineering, University of Seoul)
- Published : 1999.11.01
Abstract
The thermal properties of epoxy resin/siloxane for the electrical insulation were investigated by using dynamic DSC run method. As the heating rate increased, the peak temperature on dynamic DSC curve increased. From the linear relation on the Kissinger plot the curing reaction activation energy and pre-exponential factor could be obtained. The curing activation energy from the straight line of the Kissinger plot was 46.72 kJ/mol.