Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Packaging of Vacuum Microelectronic Device using Electrostatic Bonding

정전 열 접합에 의한 진공전자소자의 패키징

  • Ju, Byung-Kwon (KIST, Electronic Materials and Devices Research Center) ;
  • Lee, Duck-Jung (KIST, Electronic Materials and Devices Research Center) ;
  • Oh, Myung-Hwan (KIST, Electronic Materials and Devices Research Center)
  • 주병권 (한국과학기술연구원, 정보재료소자연구센터) ;
  • 이덕중 (한국과학기술연구원, 정보재료소자연구센터) ;
  • 오명환 (한국과학기술연구원, 정보재료소자연구센터)
  • Published : 1998.11.28
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Abstract

Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

Keywords