Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A Study on Patterning and Property of Cu Using Laser-Induced Deposition

레이저 유도 증착법을 이용한 CU의 패터닝 및 특성에 관한 연구

  • Kim, Jae-Kwon (Dept. of Electrical Engineering, Inha University) ;
  • Lee, Cheon (Dept. of Electrical Engineering, Inha University)
  • 김재권 (인하대학교 전기공학과) ;
  • 이천 (인하대학교 전기공학과)
  • Published : 1998.11.28
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Abstract

Copper films have been deposited on glass substrate via a thermal decomposition of copper(II) formate using a focused $Ar^+$ laser emitting at 514 nm. The growth kinetics of these Cu films was investigated as a function of laser power and scan speed which varied in the range of 70-150 mW and 0.1-20 mm/s, respectively. The resistivity of the copper films was a factor of about 20 higher than· that of bulk value, but the resistivity decreased due to changes in morphology and porosity of the deposit after annealing at $300^{\circ}C$, 5 min. and was about $10{\mu}{\Omega}cm$.

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