Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1998.07d
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- Pages.1487-1489
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- 1998
Electrical Properties and Preparation of 6FDA/4-4'DDE Polyimide Thin Films by Vapor Deposition Polymerization Method
진공증착중합법을 이용한 6FDA/4-4'DDE 폴리이미드 박막의 제조와 전기적 특성
- Hwang, S.Y. (Inha Univ.) ;
- Lee, B.J. (Inha Univ.) ;
- Kim, H.G. (Nagoya Univ.) ;
- Kim, Y.B. (Inha Coll) ;
- Park, K.S. (Chungnam Coll) ;
- Lim, H.C. (Daegu Coll) ;
- Kang, D.H. (Pukyung Univ.) ;
- Park, K.H. (Jeil Eng.) ;
- Lee, D.C. (Inha Univ.)
- 황선양 (인하대) ;
- 이붕주 (인하대) ;
- 김형권 (나고야대) ;
- 김영봉 (인하공전) ;
- 박강식 (충남전문대) ;
- 임헌찬 (대구공전) ;
- 강대하 (부경대) ;
- 박광현 (제일엔지니어링) ;
- 이덕출 (인하대)
- Published : 1998.07.20
Abstract
In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-lR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From SEM, AFM and Ellipsometer experimental, as the higher curing temperatures the films thickness decreases and reflectance increases. Therefore, Pl could be fabricated stable by increasing curing temperature. The relative permitivity and dissipation loss factor were 3.7 and 0.008. Also, the resistivity was about
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