Proceedings of the KOSOMBE Conference (대한의용생체공학회:학술대회논문집)

The Korean Society of Medical and Biological Engineering (대한의용생체공학회)
권호 표지

High-performance Digital Hearing Aid Processor Chip with Nonlinear Multiband Loudness Correction

비선형 다중채널 Loudness 교정을 위한 고성능 보청기 칩

  • Park, Young-Cheol (Samsung Biomedical Research Institute, Biomedical Engineering Center) ;
  • Kim, Dong-Wook (Samsung Biomedical Research Institute, Biomedical Engineering Center) ;
  • Kim, Won-Ky (Samsung Biomedical Research Institute, Biomedical Engineering Center) ;
  • Park, Sang-Il (Samsung Semiconductor, DSP Team)
  • 박영철 (삼성생명공학연구소 임상의공학센터) ;
  • 김동욱 (삼성생명공학연구소 임상의공학센터) ;
  • 김원기 (삼성생명공학연구소 임상의공학센터) ;
  • 박상일 (삼성반도체 DSP팀)
  • Published : 1997.05.23
Download PDF
⟨ Previous Next ⟩

Abstract

Owing to technical advances in very large-scale integrated circuits (VLSI), high-speed digital signal processing (DSP) chips become fast enough to allow for real-time implementation of hearing aid algorithms in units small enough to be wearable. In this paper, we present a digital hearing aid processor (DHAP) chip built around a general-purpose 16-bit DSP core. The designed DHAP performs a nonlinear loudness correction of 8 octave frequency bands based on audiometric measurements. By employing a programmable DSP, the DHAP provides all the flexibility needed to implement audiological algorithms. In addition, the has a low power feature and $5.410\times5.720mm^2$ dimensions that fit for wearable devices.

Keywords