대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1997년도 하계학술대회 논문집 C
- /
- Pages.1552-1554
- /
- 1997
진공증착중합법에 의해 제조된 6FDA/DDE 폴리이미드박막의 열처리에 따른 특성에 관한 연구
A study on the curing characteristics of polyimide thin film fabricated by vapor deposition polymerization
- 이봉주 (인하대학교 전기공학과) ;
- 김형권 (나고야대학교) ;
- 진윤영 (인하대학교 전기공학과) ;
- 박구범 (유한전문대학교) ;
- 김영봉 (인하공업전문대학교) ;
- 이덕출 (인하대학교 전기공학과)
- Lee, B.J. (Dept. of Electrical Eng., Inha Univ) ;
- Kim, H.G. (Nagoya Univ) ;
- Jin, Y.Y. (Dept. of Electrical Eng., Inha Univ) ;
- Park, G.B. (Yuhan Jr. Coll.) ;
- Kim, Y.B. (Inha Tech. Jr. Call.) ;
- Lee, D.C. (Dept. of Electrical Eng., Inha Univ)
- 발행 : 1997.07.21
초록
In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-IR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From AFM and ellipsometer experimental, the higher curing temperature is, the films thickness decreases and reflectance increases. Therefore, PI could be fabricated stable by increasing curing temperature.
키워드