대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1993년도 하계학술대회 논문집 B
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- Pages.1057-1059
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- 1993
용융접합된 규소 기판쌍에 있어서 접합 계면에 발생하는 제 현상들의 고찰
Consideration on the various phenomena appeared at bonding interface in fusion-bonded silicon wafer pairs
- Bhang, J.H. (Dept. of Metallurgical Engineering, Hanyang Univ.) ;
- Ju, B.K. (Applied Electronics Lab., KIST) ;
- Oh, M.H. (Applied Electronics Lab., KIST) ;
- Park, J.W. (Dept. of Metallurgical Engineering, Hanyang Univ.)
- 발행 : 1993.07.18
초록
Some interested phenomena, which were appeared near the bonding interface, were investigated by angle lapping and delineation method, SEM, and TEM observations. Voids, defects, material continuity, and interfacial oxide stability were observed and discussed in the fusion-bonded Bi-Si or Si-
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